Patents

US 12755874 B2: Process for producing cable with insulation layer

Granted
2026-10-06
Filed
2021-12-17 application 18704326
Type
Utility · 17 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The present disclosure provides a process. In an embodiment, the process includes providing an initial cable core. The initial cable core includes (i) a conductor and (ii) an initial insulation layer. The initial insulation layer includes a crosslinkable polymeric composition composed of (a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional α-olefin comonomer, and (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes (b) dicumyl peroxide (DCP), (c) an Si—H containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant. The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.

Source: PTBLXML, file of 2026-10-06 (ipgb20261006.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Dow Global Technologies LLC 4,152 patentsUS company or organizationMidland, MIDOW GLOBAL TECHNOLOGIES LLC State business registration EXACT high confidence: identical full name and statePTBLXML, file of 2026-10-06
Dow Silicones Corporation 492 patentsUS company or organizationMidland, MIPTBLXML, file of 2026-10-06

Inventors

InventorPlacePatentsPerson pageSource
Yabin SunShanghai, CN48PTBLXML, file of 2026-10-06
Gaoxiang WuLake Jackson, TX6PTBLXML, file of 2026-10-06
Colin LiPiShanLake Jackson, TX31PTBLXML, file of 2026-10-06
Timothy J. PersonCollegeville, PA55PTBLXML, file of 2026-10-06
Wenxin ZhangShanghai, CNPTBLXML, file of 2026-10-06
Kainan ZhangShanghai, CN13PTBLXML, file of 2026-10-06
Jie JiShanghai, CN5PTBLXML, file of 2026-10-06

CPC categories

SubclassCategoryFirst groupSource
H01BCables; conductors; insulators; selection of materials for their conductive, insulating or dielectric propertiesH01B19/00PTBLXML, file of 2026-10-06
C08JWorking-up; general processes of compounding; after-treatment not covered by subclasses c08b, c08c, c08f, c08g or c08hC08J3/24PTBLXML, file of 2026-10-06
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredientsC08K5/06PTBLXML, file of 2026-10-06
C08LCompositions of macromolecular compoundsC08L23/06PTBLXML, file of 2026-10-06

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.