Patents

US 12752366 B2: Systems and methods for joining and repair using ultrasonic additive manufacturing with a contoured sonotrode

Granted
2026-10-06
Filed
2023-05-31 application 18203757
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An ultrasonic additive manufacturing system may include a base structure, a sonotrode configured to rotate about an axis of rotation, and one or more transducers configured to vibrate the sonotrode. The sonotrode may include a welding surface extending along a circumference of the sonotrode, and the welding surface may have a contoured profile. At least one of the sonotrode and the base structure may be configured to translate relative to the other of the sonotrode and the base structure.

Source: PTBLXML, file of 2026-10-06 (ipgb20261006.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Ohio State Innovation Foundation 733 patentsUS company or organizationColumbus, OHOHIO STATE INNOVATION FOUNDATION Nonprofit EXACT high confidence: identical full name and statePTBLXML, file of 2026-10-06

Inventors

InventorPlacePatentsPerson pageSource
Marcelo DapinoColumbus, OHPTBLXML, file of 2026-10-06
Leon HeadingsColumbus, OHPTBLXML, file of 2026-10-06
Mark GingerichColumbus, OHPTBLXML, file of 2026-10-06

CPC categories

SubclassCategoryFirst groupSource
B23KSoldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beamB23K20/106PTBLXML, file of 2026-10-06
B23PMetal-working not otherwise provided for; combined operations; universal machine toolsB23P6/00PTBLXML, file of 2026-10-06
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y10/00PTBLXML, file of 2026-10-06

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.