Patents
US 12740020 B2: Server with hybrid thermal management system
- Granted
- 2026-09-15
- Filed
- 2024-01-09 application 18407994
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device includes cooling the at least one heat-generating electronic device with a primary cooling fluid and cooling the at least one heat-generating electronic device and the at least one peripheral heat-generating device with a secondary cooling fluid. The secondary cooling fluid is distinct from the primary cooling fluid.
Source: PTBLXML, file of 2026-09-15 (ipgb20260915.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| CARRIER CORPORATION 2,012 patents | US company or organization | Palm Beach Gardens, FL | CARRIER CORPORATION Federal lobbying client EXACT high confidence: identical full name and state | PTBLXML, file of 2026-09-15 |
| EQUINIX INC. 175 patents | US company or organization | Redwood City, CA | EQUINIX, INC. State business registration EXACT high confidence: identical full name and state EQUINIX INC Form D issuer EXACT high confidence: identical full name and state EQUINIX INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PTBLXML, file of 2026-09-15 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Arindom Joardar | Jamesville, NY | 35 | PTBLXML, file of 2026-09-15 | |
| Richard Lord | Monteagle, TN | PTBLXML, file of 2026-09-15 | ||
| Michel Grabon | Bressolles, FR | 21 | PTBLXML, file of 2026-09-15 | |
| Tobias Sienel | Baldwinsville, NY | PTBLXML, file of 2026-09-15 | ||
| My Dinh Truong | Redwood City, CA | 3 | PTBLXML, file of 2026-09-15 | |
| Tikhon Suresh Pichai | Simpsonville, SC | 13 | PTBLXML, file of 2026-09-15 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K7/20772 | PTBLXML, file of 2026-09-15 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.