Patents
US 12735313 B2: MEMS die and MEMS-based vibration sensor
- Granted
- 2026-09-15
- Filed
- 2022-07-21 application 17869870
- Type
- Utility · 12 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.
Source: PTBLXML, file of 2026-09-15 (ipgb20260915.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Knowles Electronics, LLC 414 patents | US company or organization | Itasca, IL | PTBLXML, file of 2026-09-15 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Ken Deng | Schaumburg, IL | 10 | PTBLXML, file of 2026-09-15 | |
| Michael Pedersen | Long Grove, IL | PTBLXML, file of 2026-09-15 | ||
| Richard Li-Chen Chen | Zhubei City, TW | PTBLXML, file of 2026-09-15 | ||
| Shubham Shubham | Schaumburg, IL | 8 | PTBLXML, file of 2026-09-15 | |
| Faisal Zaman | Naperville, IL | 4 | PTBLXML, file of 2026-09-15 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B3/0051 | PTBLXML, file of 2026-09-15 |
| G01C | Measuring distances, levels or bearings; surveying; navigation; gyroscopic instruments; photogrammetry or videogrammetry | G01C19/5755 | PTBLXML, file of 2026-09-15 |
| G01H | Measurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves | G01H11/06 | PTBLXML, file of 2026-09-15 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.