Patents
US 12733519 B2: Multichip module thermal management through backside metal
- Granted
- 2026-09-08
- Filed
- 2023-03-24 application 18125996
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Multichip module thermal management through backside metal systems and methods are disclosed. In one aspect, a multichip module includes one or more flip chip integrated circuits (ICs), each having a backside to which a metal heat conductor or spreader is attached. The presence of the metal heat conductor on the backside of the flip chip ICs allows for a better thermal path to remove heat from the ICs relative to the substrate. The improved thermal path reduces the likelihood of damage to the ICs or delamination of the module. A variety of methods are proposed to construct the backside metal systems. Additionally, a variety of capture features may be used to assist in structural integrity.
Source: PTBLXML, file of 2026-09-08 (ipgb20260908.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Qorvo US, Inc. 1,491 patents | US company or organization | Greensboro, NC | QORVO US, INC. Federal lobbying client EXACT high confidence: identical full name and state | PTBLXML, file of 2026-09-08 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| MD Hasnine | Richardson, TX | 8 | PTBLXML, file of 2026-09-08 | |
| Mark C. Woods | Richardson, TX | 8 | PTBLXML, file of 2026-09-08 | |
| Neftali Salazar | Oak Ridge, NC | 4 | PTBLXML, file of 2026-09-08 | |
| Smreeti Dahariya | Chapel Hill, NC | PTBLXML, file of 2026-09-08 | ||
| Christine Blair | Lewisville, TX | 5 | PTBLXML, file of 2026-09-08 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W70/614 | PTBLXML, file of 2026-09-08 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.