Patents
US 12728590 B2: Printhead, system and method for direct write vapor deposition
- Granted
- 2026-09-08
- Filed
- 2024-05-07 application 18657117
- Type
- Utility · 21 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A printhead for direct write vapor deposition comprises a nozzle body including a reservoir for holding a material to be printed and a nozzle head protruding from the nozzle body. The nozzle head includes a nozzle opening for ejection of the material as a vapor-phase ink. The nozzle opening is in fluid communication with the reservoir. The nozzle head may protrude from the nozzle body a distance of at least 10 microns. A system for direct write vapor deposition includes the printhead, a heat source positioned to heat the printhead, a substrate in opposition to the nozzle opening for deposition of the vapor-phase ink, and an x-y-z motion stage configured to move the substrate relative to the printhead.
Source: PTBLXML, file of 2026-09-08 (ipgb20260908.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| THE UNIVERSITY OF CHICAGO 523 patents | US company or organization | Chicago, IL | University of Chicago College or university FUZZY medium confidence: same name (governing-board words and legal endings aside) and state UNIVERSITY OF CHICAGO Nonprofit FUZZY medium confidence: same name (governing-board words and legal endings aside) and state | PTBLXML, file of 2026-09-08 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Supratik Guha | Chicago, IL | 86 | PTBLXML, file of 2026-09-08 | |
| Pavani Vamsi Krishna Nittala | Westmont, IL | PTBLXML, file of 2026-09-08 | ||
| Xella A Doi | Chicago, IL | PTBLXML, file of 2026-09-08 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B29C | Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing | B29C64/159 | PTBLXML, file of 2026-09-08 |
| B33Y | Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering | B33Y10/00 | PTBLXML, file of 2026-09-08 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C16/01 | PTBLXML, file of 2026-09-08 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.