Patents

US 12722346 B2: Closed loop composite welding and bonding system using radio-frequency and pressure

Granted
2026-09-01
Filed
2022-06-21 application 18573016
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A bonding system includes a heating element, an actuator, an infrared camera, a pressure sensor and/or a displacement sensor, one or more processors, and a computer readable medium storing instructions that, when executed by the one or more processors, cause the bonding system to perform functions including providing a first control signal to a heating element, thereby heating a workpiece with electromagnetic radiation having one or more oscillation frequencies within a range of 1 MHz to 2.00 MHz. and providing a second control signal to an actuator, thereby applying a pressure to the workpiece via the actuator. The functions also include detecting a temperature of the workpiece, the pressure applied to the workpiece, and/or a displacement of the actuator, and adjusting the first control signal and/or the second control signal based on the temperature of the workpiece, the pressure applied to the workpiece, or the displacement of the actuator.

Source: PTBLXML, file of 2026-09-01 (ipgb20260901.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
University of Washington 1,041 patentsUS company or organizationSeattle, WAUNIVERSITY OF WASHINGTON State business registration EXACT high confidence: identical full name and state
UNIVERSITY OF WASHINGTON Federal lobbying client EXACT high confidence: identical full name and state
UNIVERSITY OF WASHINGTON Nonprofit EXACT high confidence: identical full name and state
PTBLXML, file of 2026-09-01

Inventors

InventorPlacePatentsPerson pageSource
Aniruddh VashisthSeattle, WAPTBLXML, file of 2026-09-01
Santosh DevasiaSeattle, WA8PTBLXML, file of 2026-09-01
Ian EnriquezSeattle, WAPTBLXML, file of 2026-09-01
Katrina TeoSeattle, WAPTBLXML, file of 2026-09-01
Colin A. NoronhaSeattle, WAPTBLXML, file of 2026-09-01

CPC categories

SubclassCategoryFirst groupSource
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C66/91221PTBLXML, file of 2026-09-01
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2067/046PTBLXML, file of 2026-09-01

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.