Patents

US 12714345 B2: Soft stretchable composites and techniques for the formation thereof

Granted
2026-08-25
Filed
2022-02-25 application 18278763
Type
Utility · 11 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

In an embodiment, the present disclosure pertains to an electrode having a first layer and a second layer. In some embodiments, the first layer includes a conductive polymer. In some embodiments, the second layer is positioned above the first layer. In some embodiments, the second layer includes an inorganic material that forms a conductive network on the first layer. In an additional embodiment, the present disclosure pertains to a method of making an electrode. In general, the method providing a mold with a desired indented pattern, pouring a solution including a conductive polymer into the indented pattern to form a first layer, and pouring a solution including an inorganic material onto the first layer to form a second layer. In some embodiments, the inorganic material forms a conductive network on the first layer.

Source: PTBLXML, file of 2026-08-25 (ipgb20260825.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
The Texas A&M University System 801 patentsUS company or organizationCollege Station, TXPTBLXML, file of 2026-08-25

Inventors

InventorPlacePatentsPerson pageSource
Limei TianCollege Station, TXPTBLXML, file of 2026-08-25
Myeong NamkoongCollege Station, TXPTBLXML, file of 2026-08-25

CPC categories

SubclassCategoryFirst groupSource
A61BDiagnosis; surgery; identificationA61B5/268PTBLXML, file of 2026-08-25

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2026-07-22Assignment
Assignment of assignor's interest
TIAN, LIMEI signed 2025-11-25
NAMKOONG, MYEONG signed 2026-01-07
THE TEXAS A&M UNIVERSITY SYSTEM COLLEGE STATION, TX75349/276PASDL, file of 2026-10-06

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.