Patents
US 12709817 B2: High density and adhesion coating process and coatings formed thereby
- Granted
- 2026-08-18
- Filed
- 2023-09-29 application 18375161
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A process of applying a coating to a substrate is provided. A layer of a metallic or ceramic material is applied on the substrate by a thermal spray process. The layer is then subject to plasma electrolytic oxidation (PEO) processing to densify the layer such that a porosity of the layer after PEO processing is lower than a porosity of the layer before PEO processing, or modify the layer by incorporating additional ceramic phases from the electrolyte bath into the densified layer, or improve the adhesion of the thermal spray layer. A base layer may be applied to the substrate with PEO processing before the above referenced layer is applied and/or a ceramic topcoat may be applied to the above referenced layer by a thermal spray process.
Source: PTBLXML, file of 2026-08-18 (ipgb20260818.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| METAL IMPROVEMENT COMPANY, LLC 12 patents | US company or organization | Paramus, NJ | PTBLXML, file of 2026-08-18 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Xinqing Ma | Willington, CT | 4 | PTBLXML, file of 2026-08-18 | |
| Robin Francis | Cambridge, GB | PTBLXML, file of 2026-08-18 | ||
| Peter F. Ruggiero | Westerly, RI | 3 | PTBLXML, file of 2026-08-18 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C25D | Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor | C25D11/026 | PTBLXML, file of 2026-08-18 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C4/18 | PTBLXML, file of 2026-08-18 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2025-04-29 | Assignment Assignment of assignor's interest | MA, XINQING signed 2023-10-10 FRANCIS, ROBIN signed 2024-02-09 RUGGIERO, PETER F. signed 2024-09-12 | METAL IMPROVEMENT COMPANY, LLC PARAMUS, NJ | 70973/225 | PASDL, file of 2026-08-13 |
| 2023-12-26 | Assignment Assignment of assignor's interest | MA, XINQING signed 2023-10-10 | METAL IMPROVEMENT COMPANY, LLC PARAMUS, NJ | 65950/879 | PASDL, file of 2026-08-13 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.