Patents
US 12686187 B2: Resin transfer molding in composite manufacturing
- Granted
- 2026-07-21
- Filed
- 2024-03-14 application 18605235
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A resin transfer molding system includes a resin transfer mold configured to mold a composite material via resin injection and curing, a pressure sensor configured to measure an in-mold pressure, a dielectric sensor configured to measure an in-mold degree of cure value, a resistance circuit configured to measure an in-mold flow front position, and a molding process control module configured to determine a molding process anomaly status by comparing a specified anomaly threshold to at least one of pressure data obtained from the at least one pressure sensor, degree of cure data obtained from the at least one dielectric sensor, or flow front position data obtained from the at least one resistance circuit, reduce an injection flow rate in response to a determination of a molding process anomaly, and maintain the injection flow rate in response to a determination of normal molding process operation without the molding process anomaly.
Source: PTBLXML, file of 2026-07-21 (ipgb20260721.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| GM GLOBAL TECHNOLOGY OPERATIONS LLC 19,536 patents | US company or organization | Detroit, MI | PTBLXML, file of 2026-07-21 | |
| Board of Trustees of Michigan State University 669 patents | US company or organization | East Lansing, MI | PTBLXML, file of 2026-07-21 | |
| CSP Innovations, Inc. 4 patents | US company or organization | Auburn Hills, MI | PTBLXML, file of 2026-07-21 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Selina Xinyue Zhao | Rochester Hills, MI | PTBLXML, file of 2026-07-21 | ||
| Venkateshwar R. Aitharaju | Troy, MI | 31 | PTBLXML, file of 2026-07-21 | |
| Roger G. Ghanem | Los Angeles, CA | 2 | PTBLXML, file of 2026-07-21 | |
| Douglas Bradley | Milford, MI | PTBLXML, file of 2026-07-21 | ||
| Adam Burley | Auburn Hills, MI | PTBLXML, file of 2026-07-21 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B29C | Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing | B29C70/48 | PTBLXML, file of 2026-07-21 |
| G06N | Computing arrangements based on specific computational models | G06N3/044 | PTBLXML, file of 2026-07-21 |
| B29K | Indexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. inserts | B29K2063/00 | PTBLXML, file of 2026-07-21 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2026-06-18 | Assignment Assignment of assignor's interest | BURLEY, ADAM signed 2026-06-17 | CSP INNOVATIONS, INC. AUBURN HILLS, MI | 75003/272 | PASDL, file of 2026-08-13 |
| 2026-06-11 | Assignment Rescission of patent assignment | GM GLOBAL TECHNOLOGY OPERATIONS LLC signed 2026-06-05 | BURLEY, ADAM AUBURN HILLS, MI | 75881/63 | PASDL, file of 2026-10-15 |
| 2025-01-03 | Assignment Assignment of assignor's interest | BRADLEY, DOUGLAS signed 2024-10-21 | BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY EAST LANSING, MI | 69734/89 | PASDL, file of 2026-08-13 |
| 2025-01-03 | Assignment Assignment of assignor's interest | ZHAO, SELINA XINYUE signed 2024-02-15 AITHARAJU, VENKATESHWAR R. signed 2024-02-19 GHANEM, ROGER G. signed 2024-02-21 BURLEY, ADAM signed 2024-02-28 | GM GLOBAL TECHNOLOGY OPERATIONS LLC DETROIT, MI | 69733/267 | PASDL, file of 2026-08-13 |
| 2024-08-21 | Government interest Confirmatory license | GENERAL MOTORS LLC signed 2024-06-01 | UNITED STATES DEPARTMENT OFENERGY WASHINGTON, DC | 68350/124 | PASDL, file of 2026-08-13 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.