Patents
US 12685193 B2: Isolated metal clips with structural bridge
- Granted
- 2026-07-14
- Filed
- 2022-09-16 application 17932913
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.
Source: PTBLXML, file of 2026-07-14 (ipgb20260714.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Analog Devices, Inc. 2,069 patents | US company or organization | Wilmington, MA | ANALOG DEVICES INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PTBLXML, file of 2026-07-14 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Hien Minh Pham | Fremont, CA | 3 | PTBLXML, file of 2026-07-14 | |
| Melvin Sto Domingo Nava | Morgan Hill, CA | PTBLXML, file of 2026-07-14 | ||
| John David Brazzle | Tracy, CA | 8 | PTBLXML, file of 2026-07-14 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W70/65 | PTBLXML, file of 2026-07-14 |
| G01R | Measuring electric variables; measuring magnetic variables | G01R31/2884 | PTBLXML, file of 2026-07-14 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/181 | PTBLXML, file of 2026-07-14 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-09-16 | Assignment Assignment of assignor's interest | PHAM, HIEN MINH signed 2022-09-14 STO DOMINGO NAVA, MELVIN signed 2022-09-14 BRAZZLE, JOHN DAVID signed 2022-09-15 | ANALOG DEVICES, INC. WILMINGTON, MA | 61124/905 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.