Patents
US 12672592 B2: Integrated circuit packaging with insulation structure to control gap height and die tilt
- Granted
- 2026-06-30
- Filed
- 2024-02-22 application 18583987
- Type
- Utility · 34 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the die and the lead frame such that the die remains level and magnetic coupling remains intact. An insulation structure may control the gap height between the lead frame and the die evenly during transfer molding, by supporting the die across its length and/or width. Epoxy dots are also or instead used to control the gap height and eliminate die tilt.
Source: PTBLXML, file of 2026-06-30 (ipgb20260630.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Allegro MicroSystems, LLC 910 patents | US company or organization | Manchester, NH | ALLEGRO MICROSYSTEMS, INC. SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally | PTBLXML, file of 2026-06-30 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| David Youm | Malden, MA | PTBLXML, file of 2026-06-30 | ||
| Weidong Wang | Westford, MA | PTBLXML, file of 2026-06-30 | ||
| Natasha Healey | Manchester, NH | 7 | PTBLXML, file of 2026-06-30 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W90/811 | PTBLXML, file of 2026-06-30 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2024-02-22 | Assignment Assignment of assignor's interest | YOUM, DAVID signed 2024-02-21 WANG, WEIDONG signed 2024-02-20 HEALEY, NATASHA signed 2024-02-15 | ALLEGRO MICROSYSTEMS, LLC MANCHESTER, NH | 66529/175 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.