Patents
US 12666643 B2: Method to implant p-type and/or n-type rings in a semiconductor device
- Granted
- 2026-06-23
- Filed
- 2023-06-01 application 18327200
- Type
- Utility · 21 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
According to one aspect of the present disclosure, a semiconductor device includes a substrate having a first type dopant. In some embodiments, the semiconductor device also includes an epitaxial layer above the substrate, having a second type dopant and a top region. In some embodiments, the semiconductor device also includes a trench in the top region of the epitaxial layer; at least one doped ring implanted in the epitaxial layer below the trench; and a dielectric material filling within the trench. In some embodiments, there is a twelve-sided body tie in the epitaxial layer, wherein the sides of the twelve-sided body tie are not all equal to each other.
Source: PTBLXML, file of 2026-06-23 (ipgb20260623.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Allegro MicroSystems, LLC 910 patents | US company or organization | Manchester, NH | ALLEGRO MICROSYSTEMS, INC. SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally | PTBLXML, file of 2026-06-23 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Yu-Chun Li | New Taipei City, TW | 2 | PTBLXML, file of 2026-06-23 | |
| Thomas S. Chung | Merrimack, NH | 8 | PTBLXML, file of 2026-06-23 | |
| Maxim Klebanov | Palm Coast, FL | 44 | PTBLXML, file of 2026-06-23 | |
| Chung C. Kuo | Manchester, NH | 7 | PTBLXML, file of 2026-06-23 | |
| James M. McClay | Dudley, MA | PTBLXML, file of 2026-06-23 | ||
| Robert A. Wilson | Charlton, MA | PTBLXML, file of 2026-06-23 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10D | Inorganic electric semiconductor devices | H10D30/65 | PTBLXML, file of 2026-06-23 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-01 | Assignment Assignment of assignor's interest | LI, YU-CHUN signed 2023-05-25 CHUNG, THOMAS S. signed 2023-05-25 KLEBANOV, MAXIM signed 2023-05-25 KUO, CHUNG C. signed 2023-05-30 MCCLAY, JAMES M. signed 2023-05-30 WILSON, ROBERT A. signed 2023-05-26 GLOVER, MAX R. signed 2023-05-30 | ALLEGRO MICROSYSTEMS, LLC MANCHESTER, NH | 63828/950 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.