Patents

US 12665483 B2: Heat-sink-coupled conductor structures with integrated current sensors and eddy current mitigation

Granted
2026-06-23
Filed
2024-03-15 application 18605998
Type
Utility · 32 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Systems, circuits, and methods provide heat-sink-coupled conductive structures having eddy current mitigation structures, formed as S-notches, and integrated current sensors. An example conductive structure includes a high-current conductor structure having a main current path including an S-notch portion configured to mitigate eddy currents. The structure includes a low-current conductor structure connected to a first heat sink and having a main current path configured to conduct a second current. A differential current sensor is connected to the low-current conductor structure and configured to detect current flowing in the high-current conductor structure. A power module includes the conductive structure and a power converter that is configured to convert power between the first current in the high-current conductor structure and the second current in the low-current conductor structure. The conductive structures and power modules can be used for EV applications.

Source: PTBLXML, file of 2026-06-23 (ipgb20260623.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Allegro MicroSystems, LLC 910 patentsUS company or organizationManchester, NHALLEGRO MICROSYSTEMS, INC. SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationallyPTBLXML, file of 2026-06-23

Inventors

InventorPlacePatentsPerson pageSource
Christian KasparekHeidelberg, DE9PTBLXML, file of 2026-06-23
Simon E. RockHeidelberg, DE13PTBLXML, file of 2026-06-23

CPC categories

SubclassCategoryFirst groupSource
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems; conversion of dc or ac input power into surge output power; control or regulation thereofH02M1/0009PTBLXML, file of 2026-06-23
G01RMeasuring electric variables; measuring magnetic variablesG01R15/207PTBLXML, file of 2026-06-23

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2024-03-15Assignment
Assignment of assignor's interest
KASPAREK, CHRISTIAN signed 2024-03-07
ROCK, SIMON E. signed 2024-03-06
ALLEGRO MICROSYSTEMS GERMANY GMBH signed 2024-03-15
ALLEGRO MICROSYSTEMS EUROPE LIMITED signed 2024-03-15
ALLEGRO MICROSYSTEMS, LLC MANCHESTER, NH66785/173PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.