Patents

US 12631389 B2: High efficiency cold finger

Granted
2026-05-19
Filed
2023-08-01 application 18363042
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Thermal energy transmission from a cryocooler cold finger is enhanced by means of a high thermal conductivity material used for or placed adjacent the cold finger end cap. In addition, the actual or effective surface area contacted by the working gas proximate the endcap is increased, thereby increasing the convective heat transfer coefficient. These features permit the coolest gas expansion space in the cold finger to be provided within the highly thermally conductive end cap, unlike many conventional designs in which the cold finger of low thermally conductive metal forms the expansion space side walls and the endcap forms only the axially facing outer surface in contact with the cooled equipment. Having the expansion space built into the high thermally conductive end cap reduces the temperature drop between the load to be cooled and the gas (e.g., helium), thus increasing the thermodynamic cycle efficiency.

Source: PTBLXML, file of 2026-05-19 (ipgb20260519.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
L3Harris Technologies, Inc. 160 patentsUS company or organizationMelbourne, FLPTBLXML, file of 2026-05-19

Inventors

InventorPlacePatentsPerson pageSource
Stephen Max StyonavichLoveland, OHPTBLXML, file of 2026-05-19
Christopher BartonCincinnati, OHPTBLXML, file of 2026-05-19
Vincent LieuMaineville, OHPTBLXML, file of 2026-05-19
Uri Bin-NunWestford, MAPTBLXML, file of 2026-05-19

CPC categories

SubclassCategoryFirst groupSource
F25DRefrigerators; cold rooms; ice-boxes; cooling or freezing apparatus not otherwise provided forF25D19/006PTBLXML, file of 2026-05-19

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2026-02-19Assignment
Assignment of assignor's interest
L3HARRIS TECHNOLOGIES, INC. signed 2026-02-18L3HARRIS CINCINNATI ELECTRONICS CORPORATION MASON, OH73831/408PASDL, file of 2026-10-15
2023-08-01Assignment
Assignment of assignor's interest
STYONAVICH, STEPHEN MAX signed 2023-07-26
BARTON, CHRISTOPHER signed 2023-07-31
LIEU, VINCENT signed 2023-07-26
BIN-NUN, URI signed 2023-07-26
L3HARRIS TECHNOLOGIES, INC. MELBOURNE, FL64446/176PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.