Patents
US 12620783 B1: Methods for 3D-integrating photonic chipsets by vertical assembly of lasers and passive components
- Granted
- 2026-05-05
- Filed
- 2023-05-20 application 18199944
- Type
- Utility · 30 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method for making a vertically arranged array of edge-emitting lasers comprises: obtaining semiconductor chips that are laser diodes or semiconductor optical amplifiers; coating each of the semiconductor chips with a thermally conductive dielectric material; bonding the semiconductor chips onto a carrier wafer, such that the semiconductor chips are vertically aligned; coating the semiconductor chips with an electroplating seed material; obtaining a body wafer having lithographically defined and passivated openings; positioning the body wafer and the carrier wafer to match the openings; electroplating a metal-containing material onto the seed material to fill open space; demounting the body wafer from the carrier wafer; etching excess material from the body wafer; and patterning metal regions in electrical contact with the semiconductor chips. A vertically arranged array of edge-emitting lasers is fabricated and is capable of emitting laser light parallel to the semiconductor chips and perpendicular to the plane of the body wafer.
Source: PTBLXML, file of 2026-05-05 (ipgb20260505.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HRL Laboratories, LLC 1,601 patents | US company or organization | Malibu, CA | PTBLXML, file of 2026-05-05 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| John Carlson | Westlake Village, CA | PTBLXML, file of 2026-05-05 | ||
| Travis Autry | Calabasas, CA | 6 | PTBLXML, file of 2026-05-05 | |
| Florian Herrault | Agoura Hills, CA | PTBLXML, file of 2026-05-05 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01S | Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light; devices using stimulated emission of electromagnetic radiation in wave ranges other than optical | H01S5/405 | PTBLXML, file of 2026-05-05 |
| H10H | Inorganic light-emitting semiconductor devices having potential barriers | H10H20/858 | PTBLXML, file of 2026-05-05 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-05-20 | Assignment Assignment of assignor's interest | CARLSON, JOHN signed 2023-05-12 AUTRY, TRAVIS signed 2023-05-16 HERRAULT, FLORIAN signed 2023-05-07 | HRL LABORATORIES, LLC MALIBU, CA | 63710/321 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.