Patents

US 12618124 B2: Oxidation resistant high conductivity copper alloys

Granted
2026-05-05
Filed
2022-12-15 application 18066843
Type
Utility · 9 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A micro-alloyed copper powder was produced using gas atomization reaction synthesis, with the alloy preferably comprising Cu-0.3Zr-0.15Ag wt. %. The novel copper alloy improves the manufacturability of copper in powder bed fusion manufacturing processes by minimizing or avoiding the prior art problems associated with oxidation of the copper precursor used in additive manufacturing. Advantageously, the provided copper alloy powder maintains the high electrical conductivity of copper while addressing the prior art oxidation issue.

Source: PTBLXML, file of 2026-05-05 (ipgb20260505.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Honeywell Federal Manufacturing & Technologies, LLC 299 patentsUS company or organizationKansas City, MOPTBLXML, file of 2026-05-05
Iowa State University Research Foundation, Inc. 581 patentsUS company or organizationAmes, IAPTBLXML, file of 2026-05-05

Inventors

InventorPlacePatentsPerson pageSource
Christian Gentry Miles BarrKansas City, MOPTBLXML, file of 2026-05-05
Timothy ProstFremont, CAPTBLXML, file of 2026-05-05

CPC categories

SubclassCategoryFirst groupSource
C22CAlloysC22C9/00PTBLXML, file of 2026-05-05
B22FWorking metallic powder; manufacture of articles from metallic powder; making metallic powder ; apparatus or devices specially adapted for metallic powderB22F10/28PTBLXML, file of 2026-05-05
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y70/00PTBLXML, file of 2026-05-05

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-07-11Government interest
Confirmatory license
IOWA STATE UNIVERSITY signed 2023-06-09UNITED STATES DEPARTMENT OF ENERGY WASHINGTON, DC64239/700PASDL, file of 2026-10-15
2023-06-21Assignment
Assignment of assignor's interest
PROST, TIMOTHY signed 2023-05-17IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. AMES, IA64017/449PASDL, file of 2026-10-15
2023-06-21Assignment
Assignment of assignor's interest
BARR, CHRISTIAN GENTRY MILES signed 2023-03-16HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC KANSAS CITY, MO64017/247PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.