Patents
US 12617670 B2: MEMS bump stopper surface features
- Granted
- 2026-05-05
- Filed
- 2022-12-22 application 18087602
- Type
- Utility · 9 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
Source: PTBLXML, file of 2026-05-05 (ipgb20260505.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Knowles Electronics, LLC 414 patents | US company or organization | Itasca, IL | PTBLXML, file of 2026-05-05 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Ken Deng | Schaumburg, IL | 10 | PTBLXML, file of 2026-05-05 | |
| Bing Yu | Elk Grove Village, IL | 37 | PTBLXML, file of 2026-05-05 | |
| Michael Pedersen | Long Grove, IL | PTBLXML, file of 2026-05-05 | ||
| Nicholas Palcheck | Roselle, IL | PTBLXML, file of 2026-05-05 | ||
| Jeremy Johnson | Glen Ellyn, IL | 22 | PTBLXML, file of 2026-05-05 | |
| Richard Li-Chen Chen | Zhubei, TW | PTBLXML, file of 2026-05-05 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B3/0013 | PTBLXML, file of 2026-05-05 |
| B81C | Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems | B81C1/00111 | PTBLXML, file of 2026-05-05 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-12-23 | Assignment Assignment of assignor's interest | DENG, KEN signed 2022-12-16 YU, BING signed 2022-12-21 PEDERSEN, MICHAEL signed 2022-12-16 PALCHECK, NICHOLAS signed 2022-12-16 JOHNSON, JEREMY signed 2022-12-21 CHEN, RICHARD LI-CHEN signed 2022-12-20 | KNOWLES ELECTRONICS, LLC ITASCA, IL | 62193/486 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.