Patents
US 12615988 B2: Cleaning brush for semiconductor fabrication process
- Granted
- 2026-04-28
- Filed
- 2023-05-31 application 18204238
- Type
- Utility · 12 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A cleaning brush for a semiconductor fabrication process is provided. The cleaning brush includes a core and a brush member. The core includes a circumferential portion and a closed end portion. The circumferential portion surrounds a rotation axis of the cleaning brush and defines an inlet opening for receiving a fluid. The closed end portion is connected to an end of the circumferential portion that is opposite to the inlet opening along the rotation axis. At least one elongated conduit is defined within the core and fluidly communicated with the inlet opening, and the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion. The brush member is connected to an outer surface of the circumferential portion and covers all of the outlet channels.
Source: PTBLXML, file of 2026-04-28 (ipgb20260428.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| ENTEGRIS, INC. 666 patents | US company or organization | Billerica, MA | ENTEGRIS, INC. Federal lobbying client EXACT high confidence: identical full name and state ENTEGRIS INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PTBLXML, file of 2026-04-28 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Aravind Vasanthakumar | Singapore, SG | 7 | PTBLXML, file of 2026-04-28 | |
| Thines Kumar Perumal | Singapore, SG | 10 | PTBLXML, file of 2026-04-28 | |
| Subhash Guddati | Singapore, SG | 11 | PTBLXML, file of 2026-04-28 | |
| Montray Leavy | Singapore, SG | 16 | PTBLXML, file of 2026-04-28 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01L | Semiconductor devices not covered by class h10 | H01L21/67046 | PTBLXML, file of 2026-04-28 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-05-31 | Assignment Assignment of assignor's interest | VASANTHAKUMAR, ARAVIND signed 2023-03-06 PERUMAL, THINES KUMAR signed 2023-03-06 GUDDATI, SUBHASH signed 2023-03-06 LEAVY, MONTRAY signed 2023-03-06 | ENTEGRIS, INC. BILLERICA, MA | 63816/385 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.