Patents
US 12598836 B1: Photonic integrated module with metal embedded chips
- Granted
- 2026-04-07
- Filed
- 2023-08-02 application 18364455
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A photonic module and a method of making same, the module having one or more optoelectronic chips, such as a laser diode typically having six sides, with each optoelectronic chip having two opposing sides (a first side and a second side) abutting and electrically connected to metal regions (preferably electro-formed), the two metal regions are physically distinct and electrically separate from each other, the two electro-formed metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.
Source: PTBLXML, file of 2026-04-07 (ipgb20260407.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HRL LABORATORIES, LLC 1,601 patents | US company or organization | Malibu, CA | PTBLXML, file of 2026-04-07 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Daniel Yap | Newbury Park, CA | 79 | PTBLXML, file of 2026-04-07 | |
| Florian G. Herrault | Agoura Hills, CA | 44 | PTBLXML, file of 2026-04-07 | |
| Christopher S. Roper | Oak Park, CA | 90 | PTBLXML, file of 2026-04-07 | |
| Partia Naghibi | Canoga Park, CA | 2 | PTBLXML, file of 2026-04-07 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10F | Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation | H10F77/413 | PTBLXML, file of 2026-04-07 |
| G02B | Optical elements, systems or apparatus | G02B6/42 | PTBLXML, file of 2026-04-07 |
| H10H | Inorganic light-emitting semiconductor devices having potential barriers | H10H20/858 | PTBLXML, file of 2026-04-07 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.