Patents

US 12552659 B2: MEMS die and MEMS-based sensor

Granted
2026-02-17
Filed
2022-01-07 application 17571186
Type
Utility · 11 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm.

Source: PTBLXML, file of 2026-02-17 (ipgb20260217.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Knowles Electronics, LLC 414 patentsUS company or organizationItasca, ILPTBLXML, file of 2026-02-17

Inventors

InventorPlacePatentsPerson pageSource
Michael PedersenLong Grove, ILPTBLXML, file of 2026-02-17

CPC categories

SubclassCategoryFirst groupSource
B81BMicrostructural devices or systems, e.g. micromechanical devicesB81B3/0021PTBLXML, file of 2026-02-17

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

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