Patents

US 12515399 B2: Nozzles including polycrystalline diamond or polycrystalline cubic boron nitride and related assemblies and methods

Granted
2026-01-06
Filed
2022-04-04 application 17713170
Type
Utility · 21 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Embodiments are directed to nozzles for three-dimensional printing and related nozzle assemblies and methods. An example nozzle includes at least one top surface, at least one bottom surface, and at least one nozzle lateral surface extending from or near the top surface to or near the bottom surface. The nozzle also includes at least one conduit surface defining a conduit. At least a portion of the conduit surface comprise at least one of polycrystalline diamond (“PCD”), polycrystalline cubic boron nitride (“PcBN”), or another suitable superhard material. The nozzle may be attached to a base to form a nozzle assembly. The nozzle may be attached to the base by at least one of deforming the base relative to the nozzle, threadedly attaching (either directly or indirectly) the nozzle to the base, or press-fitting a hollow hollowed-sleeve into a passageway defined by the base.

Source: PTBLXML, file of 2026-02-13 (ipgb20260106.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
US SYNTHETIC CORPORATION 551 patentsUS company or organizationOrem, UTUS SYNTHETIC CORPORATION State business registration EXACT high confidence: identical full name and statePTBLXML, file of 2026-02-13

Inventors

InventorPlacePatentsPerson pageSource
Harris TaylorLehi, UT3PTBLXML, file of 2026-02-13
Jacob CrockettOrem, UT3PTBLXML, file of 2026-02-13
Jarrett MeierLehi, UT10PTBLXML, file of 2026-02-13
Scott SchmidtDraper, UT8PTBLXML, file of 2026-02-13

CPC categories

SubclassCategoryFirst groupSource
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C64/209PTBLXML, file of 2026-02-13
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y30/00PTBLXML, file of 2026-02-13
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2907/02PTBLXML, file of 2026-02-13

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-07-18Security interest Security interest
Security interest
US SYNTHETIC CORPORATION signed 2025-07-18KEYBANK NATIONAL ASSOCIATION OVERLAND PARK, IL74973/89PASDL, file of 2026-10-18
2025-07-17Release of security interest
Release of security interest in patents
JPMORGAN CHASE BANK, N.A. signed 2025-07-16CHAMPIONX LLC THE WOODLANDS, TX
APERGY ESP SYSTEMS, LLC THE WOODLANDS, TX
APERGY BMCS ACQUISITION CORP THE WOODLANDS, TX
HARBISON-FISCHER, INC. THE WOODLANDS, TX
NORRIS RODS, INC., THE WOODLANDS, TX
NORRIS RODS, INC., THE WOODLANDS, TX
NORRISEAL-WELLMARK, INC. THE WOODLANDS, TX
PCS FERGUSON, INC. THE WOODLANDS, TX
QUARTZDYNE, INC. THE WOODLANDS, TX
US SYNTHETIC CORPORATION THE WOODLANDS, TX
72004/19PASDL, file of 2026-10-15
2025-03-13Assignment
Assignment of assignor's interest
TAYLOR, HARRIS signed 2021-05-12
CROCKETT, JACOB signed 2021-05-12
MEIER, JARRETT H. signed 2021-05-12
SCHMIDT, SCOTT signed 2021-06-02
US SYNTHETIC CORPORATION OREM, UT70499/390PASDL, file of 2026-10-15
2022-06-08Security interest Security interest
Security interest
APERGY BMCS ACQUISITION CORP. signed 2022-06-07
APERGY ESP SYSTEMS, LLC signed 2022-06-07
CHAMPIONX USA INC. signed 2022-06-07
HARBISON-FISCHER, INC. signed 2022-06-07
NORRIS-RODS, INC. signed 2022-06-07
PCS FERGUSON, INC. signed 2022-06-07
THETA OILFIELD SERVICES, INC. signed 2022-06-07
US SYNTHETIC CORPORATION signed 2022-06-07
JPMORGAN CHASE BANK, N.A. NEWARK, DE60313/456PASDL, file of 2026-10-15
2022-04-04Assignment
Assignment of assignor's interest
TAYLOR, HARRIS signed 2021-05-12
CROCKETT, JACOB signed 2021-05-12
MEIER, JARRETT signed 2021-05-12
SCHMIDT, SCOTT signed 2021-06-02
US SYNTHETIC CORPORATION OREM, UT59495/244PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.