Patents

US 12511988 B2: Liquid jet cutting head sensor systems and methods

Granted
2025-12-30
Filed
2024-06-18 application 18746045
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An operational monitoring system for use with a liquid jet cutting system can include an accelerometer coupled to a cutting head of the liquid jet cutting system. The accelerometer can be configured to generate motion data associated with movement of the cutting head. The system can include a computing device operably connected to the accelerometer and having a memory and a processor. The memory can store a planned data set including expected parameters associated with movement of the cutting head along a planned cut path. In some embodiments, the computing device is configured to receive the motion data from the accelerometer and correlate the motion data to the planned data set.

Source: PVGPATDIS, file of 2026-04-10 (ipg251230.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hypertherm, Inc. 239 patentsUS company or organizationHanover, NHHYPERTHERM INC Form D issuer EXACT high confidence: identical full name and state
HYPERTHERM, INC. Federal lobbying client EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Cedar VandergonNew Brighton, MN22PVGPATDIS, file of 2026-04-10
William W. SchultzShoreview, MN4Person page FUZZY medium confidencePVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G08BSignalling systems, e.g. personal calling systems; order telegraphs; alarm systemsG08B21/18PVGPATDIS, file of 2026-04-10
B05BSpraying apparatus; atomising apparatus; nozzlesB05B12/004PVGPATDIS, file of 2026-04-10
B26FPerforating; punching; cutting-out; stamping-out; severing by means other than cuttingB26F3/004PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-10-08Assignment
Assignment of assignor's interest
SCHULTZ, WILLIAM signed 2022-09-20
VANDERGON, CEDAR signed 2022-09-20
HYPERTHERM, INC. HANOVER, NH72507/957ECORSEXC, file of 2026-09-25
2024-12-13Security interest Security interest
Security interest
HYPERTHERM, INC. signed 2024-12-05BANK OF AMERICA, N.A. CHARLOTTE, NC69577/777PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.