Patents
US 12509344 B2: Microelectromechanical systems die
- Granted
- 2025-12-30
- Filed
- 2022-12-28 application 18090361
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A microelectromechanical system (MEMS) die includes a substrate, a diaphragm made from a conductive material and supported over the substrate, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate. The backplate includes a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.
Source: PVGPATDIS, file of 2026-04-10 (ipg251230.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Knowles Electronics, LLC 414 patents | US company or organization | Itasca, IL | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Yunfei Ma | Buffalo Grove, IL | 25 | PVGPATDIS, file of 2026-04-10 | |
| Ann George | Itasca, IL | 1 | PVGPATDIS, file of 2026-04-10 | |
| Shubham Shubham | Schaumburg, IL | 8 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B3/0008 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-12-28 | Assignment Assignment of assignor's interest | MA, YUNFEI signed 2022-12-19 SHUBHAM, SHUBHAM signed 2022-12-19 GEORGE, ANN signed 2022-12-20 | KNOWLES ELECTRONICS, LLC ITASCA, IL | 62228/667 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.