Patents

US 12497523 B2: Method of printing with polymer powder and siloxane additive

Granted
2025-12-16
Filed
2024-04-22 application 18642703
Type
Utility · 15 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A powder composition suitable for use in selective laser sintering for printing an object. The powder composition includes a first fraction having a polyetherketoneketone (PEKK) powder having a plurality of particles. The powder composition includes a second fraction having a plurality of siloxane particles that is dry blended with the PEKK powder prior to selective laser sintering of the powder. In some embodiments, the powder composition includes a third fraction of carbon fiber. The powder composition when used in selective laser sintering results in parts with more consistent results and improves process economics.

Source: PVGPATDIS, file of 2026-04-10 (ipg251216.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hexcel Corporation 118 patentsUS company or organizationSan Ramon, CAPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Whitney KlineEllington, CT5PVGPATDIS, file of 2026-04-10
Alden WinnGlastonbury, CT5PVGPATDIS, file of 2026-04-10
Lawrence VarholakSouthbury, CT4PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C09DCoating compositions, e.g. paints, varnishes or lacquers; filling pastes; chemical paint or ink removers; inks; correcting fluids; woodstains; pastes or solids for colouring or printing; use of materials thereforC09D11/102PVGPATDIS, file of 2026-04-10
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C64/153PVGPATDIS, file of 2026-04-10
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y10/00PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2071/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2024-05-09Assignment
Assignment of assignor's interest
KLINE, WHITNEY signed 2019-05-17
WINN, ALDEN signed 2019-05-17
VARHOLAK, LAWRENCE signed 2019-05-23
HEXCEL CORPORATION STAMFORD, CT67365/417ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.