Patents

US 12491576 B2: Edge shaping using material processing systems

Granted
2025-12-09
Filed
2022-08-24 application 17894229
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A computer-implemented method is provided for shaping an edge of a part to be cut from a workpiece using a material processing system comprising a processing head configured to deliver a processing stream. The method includes calculating a start point and an end point of a shaping path proximate to the edge of the part based on a desired edge profile and determining a set of operating parameters to controllably impinge the processing stream about the edge of the part to execute the shaping path from the start point to the end point. The method further includes positioning the processing head normal to a surface of the part and controllably impinging the processing stream at the edge of the part, by the processing head, to shape the desired edge profile.

Source: PVGPATDIS, file of 2026-04-10 (ipg251209.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hypertherm, Inc. 239 patentsUS company or organizationHanover, NHHYPERTHERM INC Form D issuer EXACT high confidence: identical full name and state
HYPERTHERM, INC. Federal lobbying client EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Yu ZhangHanover, NH42PVGPATDIS, file of 2026-04-10
Steven MoodyCharlestown, NH9PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B23KSoldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beamB23K10/00PVGPATDIS, file of 2026-04-10
B24CAbrasive or related blasting with particulate materialB24C1/045PVGPATDIS, file of 2026-04-10
B26DCutting; details common to machines for perforating, punching, cutting-out, stamping-out or severingB26D3/02PVGPATDIS, file of 2026-04-10
B26FPerforating; punching; cutting-out; stamping-out; severing by means other than cuttingB26F3/004PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2024-12-13Security interest Security interest
Security interest
HYPERTHERM, INC. signed 2024-12-05BANK OF AMERICA, N.A. CHARLOTTE, NC69577/777PASDL, file of 2026-10-15
2023-05-12Assignment
Assignment of assignor's interest
MOODY, STEVEN signed 2023-05-08
ZHANG, YU signed 2023-05-08
HYPERTHERM, INC. HANOVER, NH63622/530ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.