Patents

US 12485609 B2: Nozzles, nozzle assemblies, and related methods

Granted
2025-12-02
Filed
2022-04-04 application 17713161
Type
Utility · 32 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Embodiments are directed to nozzles for three-dimensional printing and related nozzle assemblies and methods. An example nozzle includes at least one top surface, at least one bottom surface, and at least one lateral surface extending from or near the top surface to or near the bottom surface. The nozzle includes at least one conduit surface defining a conduit. The conduit surface extends from or near the top surface to or near the bottom surface. In an embodiment, at least a portion of the conduit surface proximate to the top surface is non-vertical (e.g., defines a non-cylindrical or non-rectangular shape). The non-vertical conduit surface may be positioned such that it is not parallel to a central axis of the nozzle extending from the top surface to the bottom surface.

Source: PVGPATDIS, file of 2026-04-10 (ipg251202.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
US Synthetic Corporation 551 patentsUS company or organizationOrem, UTUS SYNTHETIC CORPORATION State business registration EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Harris TaylorLehi, UT3PVGPATDIS, file of 2026-04-10
Jacob CrockettOrem, UT3PVGPATDIS, file of 2026-04-10
Jarrett MeierLehi, UT10PVGPATDIS, file of 2026-04-10
Scott SchmidtDraper, UT8PVGPATDIS, file of 2026-04-10
Michael James GleasonOrem, UT21PVGPATDIS, file of 2026-04-10
Brian ShueyEagle Mountain, UT6PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C64/209PVGPATDIS, file of 2026-04-10
B22FWorking metallic powder; manufacture of articles from metallic powder; making metallic powder ; apparatus or devices specially adapted for metallic powderB22F12/53PVGPATDIS, file of 2026-04-10
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y10/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-07-18Security interest Security interest
Security interest
US SYNTHETIC CORPORATION signed 2025-07-18KEYBANK NATIONAL ASSOCIATION OVERLAND PARK, IL74973/89PASDL, file of 2026-10-18
2025-07-17Release of security interest
Release of security interest in patents
JPMORGAN CHASE BANK, N.A. signed 2025-07-16CHAMPIONX LLC THE WOODLANDS, TX
APERGY ESP SYSTEMS, LLC THE WOODLANDS, TX
APERGY BMCS ACQUISITION CORP THE WOODLANDS, TX
HARBISON-FISCHER, INC. THE WOODLANDS, TX
NORRIS RODS, INC., THE WOODLANDS, TX
NORRIS RODS, INC., THE WOODLANDS, TX
NORRISEAL-WELLMARK, INC. THE WOODLANDS, TX
PCS FERGUSON, INC. THE WOODLANDS, TX
QUARTZDYNE, INC. THE WOODLANDS, TX
US SYNTHETIC CORPORATION THE WOODLANDS, TX
72004/19PASDL, file of 2026-10-15
2022-06-08Security interest Security interest
Security interest
APERGY BMCS ACQUISITION CORP. signed 2022-06-07
APERGY ESP SYSTEMS, LLC signed 2022-06-07
CHAMPIONX USA INC. signed 2022-06-07
HARBISON-FISCHER, INC. signed 2022-06-07
NORRIS-RODS, INC. signed 2022-06-07
PCS FERGUSON, INC. signed 2022-06-07
THETA OILFIELD SERVICES, INC. signed 2022-06-07
US SYNTHETIC CORPORATION signed 2022-06-07
JPMORGAN CHASE BANK, N.A. NEWARK, DE60313/456PASDL, file of 2026-10-15
2022-04-04Assignment
Assignment of assignor's interest
MEIER, JARRETT signed 2021-05-26
SCHMIDT, SCOTT signed 2021-06-02
GLEASON, MICHAEL JAMES signed 2021-06-14
SHUEY, BRIAN signed 2021-06-14
CROCKETT, JACOB signed 2021-06-16
TAYLOR, HARRIS signed 2021-06-16
US SYNTHETIC CORPORATION OREM, UT59495/211ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.