Patents
US 12476038 B2: Nested flat wound coils forming windings for transformers and inductors
- Granted
- 2025-11-18
- Filed
- 2021-05-03 application 17306476
- Type
- Utility · 24 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
An electro-magnetic device is provided, including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set. A method of making an electro-magnetic device including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set is also provided.
Source: PVGPATDIS, file of 2026-04-10 (ipg251118.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Vishay Dale Electronics, LLC 74 patents | US company or organization | Columbus, NE | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Matthew Foley | Berwick, ME | 8 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01F | Magnets; inductances; transformers; selection of materials for their magnetic properties | H01F27/2828 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2025-10-24 | Assignment Assignment of assignor's interest | FOLEY, MATTHEW J. signed 2017-02-21 | VISHAY DALE ELECTRONICS, LLC COLUMBUS, NE | 72668/885 | ECORSEXC, file of 2026-09-25 |
| 2025-09-16 | Security interest Security interest Security interest | VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC) signed 2025-09-08 VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY INTERTECHNOLOGY, INC. signed 2025-09-08 | JPMORGAN CHASE BANK, N.A. CHICAGO, IL | 72272/193 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.