Patents
US 12440924 B2: Laser-based high-throughput surface nano-structuring (NHSN) process
- Granted
- 2025-10-14
- Filed
- 2021-02-12 application 17175223
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Embodiments of the present invention are directed to a surface modified metal piece comprising a first major surface, wherein at least one portion of the first major surface: comprises the reaction product of a surface modifier; has a random micro- and nanoscale structure; and has at least one of a water contact angle when exposed to water of at least about 120° and a spectral reflectance of less than about 25% within the visible spectrum. Other embodiments relate to processes and methods for making such a surface modified metal piece.
Source: PVGPATDIS, file of 2026-04-10 (ipg251014.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| University of Iowa Research Foundation 401 patents | US company or organization | Iowa City, IA | UNIVERSITY OF IOWA RESEARCH FOUNDATION Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Hongtao Ding | Coralville, IA | 4 | PVGPATDIS, file of 2026-04-10 | |
| Qinghua Wang | Iowa City, IA | 40 | PVGPATDIS, file of 2026-04-10 | |
| Avik Samanta | Iowa City, IA | 2 | PVGPATDIS, file of 2026-04-10 | |
| Ninggang Shen | Iowa City, IA | 1 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B23K | Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam | B23K26/355 | PVGPATDIS, file of 2026-04-10 |
| B05D | Processes for applying fluent materials to surfaces, in general | B05D5/08 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-05-31 | Assignment Assignment of assignor's interest | DING, HONGTAO signed 2018-08-30 SAMANTA, AVIK signed 2018-08-30 SHEN, NINGGANG signed 2018-08-30 WANG, QINGHUA signed 2018-08-30 | UNIVERSITY OF IOWA RESEARCH FOUNDATION IOWA CITY, IA | 63804/599 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.