Patents

US 12428776 B2: Method of manufacturing carbon fiber-reinforced composite including thermal barrier coating layer

Granted
2025-09-30
Filed
2023-09-06 application 18461948
Type
Utility · 11 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Disclosed herein a method of manufacturing a carbon fiber-reinforced composite including a thermal barrier coating layer, the method includes: preparing a thermal barrier coating layer; preparing a substrate including a carbon fiber fabric; and attaching the thermal barrier coating layer on an upper portion of the substrate and molding a composite with a resin transfer molding.

Source: PVGPATDIS, file of 2026-04-10 (ipg250930.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Korea Institute of Science and Technology 1,574 patentsForeign company or organizationSeoul, KRPVGPATDIS, file of 2026-04-10
Utah State University 160 patentsUS company or organizationNot reportedUtah State University College or university EXACT high confidence: identical full name and state
UTAH STATE UNIVERSITY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Min Wook LeeJukjeol-ri, KR9PVGPATDIS, file of 2026-04-10
Hee Jin KimJukjeol-ri, KR98PVGPATDIS, file of 2026-04-10
Jungwon KIMJukjeol-ri, KR24PVGPATDIS, file of 2026-04-10
Juhyeong LeeIncheon, KR2PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C70/088PVGPATDIS, file of 2026-04-10
D06MTreatment, not provided for elsewhere in class d06, of fibres, threads, yarns, fabrics, feathers or fibrous goods made from such materialsD06M11/45PVGPATDIS, file of 2026-04-10
D10BIndexing scheme associated with sublasses of section d, relating to textilesD10B2101/12PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-08-15Assignment
Assignment of assignor's interest
KIM, HEE JIN signed 2023-09-22
KIM, JUNGWON signed 2023-09-22
LEE, MIN WOOK signed 2023-09-22
LEE, JUHYEONG signed 2024-10-04
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY SEOUL
UTAH STATE UNIVERSITY LOGAN, UT
72037/901ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.