Patents

US 12419581 B2: Wireless measurement of suture tension

Granted
2025-09-23
Filed
2025-01-23 application 19035284
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Certain examples of the disclosure concern an implantable sensor. The implantable sensor includes a sensor assembly configured to connect to a suture. The sensor assembly also includes a substrate and a resonant circuit coupled to the substrate. The resonant circuit is configured to electrically resonate at a resonant frequency when exposed to a first electromagnetic field and to emit a second remotely detectable electromagnetic field. The substrate is configured to deform in response to a tensile force applied by the suture and to change a resonant parameter of the resonant circuit in response to the deformation.

Source: PVGPATDIS, file of 2026-04-10 (ipg250923.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
University of Oregon 77 patentsUS company or organizationEugene, ORUniversity of Oregon College or university EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Keat Ghee OngEugene, OR6PVGPATDIS, file of 2026-04-10
Salil Sidharthan KaripottEugene, OR1PVGPATDIS, file of 2026-04-10
Robert E. GuldbergEugene, OR9PVGPATDIS, file of 2026-04-10
Kaylee M. MeyersEugene, OR1PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
A61BDiagnosis; surgery; identificationA61B5/6883PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-03-04Assignment
Assignment of assignor's interest
ONG, KEAT GHEE signed 2022-09-06
KARIPOTT, SALIL SIDHARTHAN signed 2022-08-11
GULDBERG, ROBERT ERLING signed 2022-08-14
MEYERS, KAYLEE M. signed 2022-08-12
UNIVERSITY OF OREGON EUGENE, OR70392/965PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.