Patents
US 12406178 B2: Apparatus and method for heat source localization and peak temperature estimation
- Granted
- 2025-09-02
- Filed
- 2019-08-06 application 16533092
- Type
- Utility · 5 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A heat source sensor includes a plurality of first wires extending in a first direction, a plurality of second wires extending in a second direction different from the first direction and crossing the plurality of first wires, and a plurality of nodes. Each node is defined at a crossing of a first wire of the plurality of first wires and a second wire of the plurality of second wires. The first wire is secured to the second wire at the node. Each node of the plurality of nodes defines a measurement point of the heat source sensor, with a difference in thermoelectric electromotive forces between two nodes of the plurality of nodes indicative of a temperature difference between the two nodes.
Source: PVGPATDIS, file of 2026-04-10 (ipg250902.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| WESTERN NEW ENGLAND UNIVERSITY 25 patents | US company or organization | Springfield, MA | WESTERN NEW ENGLAND UNIVERSITY State business registration EXACT high confidence: identical full name and state Western New England University College or university EXACT high confidence: identical full name and state WESTERN NEW ENGLAND UNIVERSITY Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Jingzhou Zhao | East Longmeadow, MA | 4 | PVGPATDIS, file of 2026-04-10 | |
| Feng Ye | Beavercreek, OH | 32 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G06N | Computing arrangements based on specific computational models | G06N3/065 | PVGPATDIS, file of 2026-04-10 |
| G06F | Electric digital data processing | G06F17/11 | PVGPATDIS, file of 2026-04-10 |
| H10N | Electric solid-state devices not otherwise provided for | H10N10/01 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2019-08-08 | Assignment Assignment of assignor's interest | YE, FENG signed 2019-06-11 ZHAO, JINGZHOU signed 2019-06-11 | WESTERN NEW ENGLAND UNIVERSITY SPRINGFIELD, MA | 49997/319 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.