Patents

US 12364157 B2: Short-wave infrared materials, detectors, and methods

Granted
2025-07-15
Filed
2022-08-01 application 17878620
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Aspects of the present disclosure generally relate to short-wave infrared (SWIR) materials, SWIR detectors, and methods of use. In an aspect, a SWIR detector is provided and includes a conductive layer disposed over a first portion of a substrate, the conductive layer having a trench therein, and a hole transport layer disposed over at least a second portion of the substrate and within the trench of the conductive layer. The SWIR detector further includes a light conversion layer disposed over at least a portion of the hole transport layer, the light conversion layer comprising a composition having the formula AaBbMcXd, wherein: A is an organic group or ion thereof; B is an organic group, an inorganic group, or ion thereof; M is a metal or ion thereof; X is a halogen or ion thereof; and a, b, c, and d are numbers expressing amounts of A, B, M, and X.

Source: PVGPATDIS, file of 2026-04-10 (ipg250715.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HONDA MOTOR CO., LTD. 19,595 patentsForeign company or organizationTokyo, JPPVGPATDIS, file of 2026-04-10
Utah State University 160 patentsUS company or organizationLogan, UTUtah State University College or university EXACT high confidence: identical full name and state
UTAH STATE UNIVERSITY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Gugang ChenPalo Alto, CA27PVGPATDIS, file of 2026-04-10
Yi RaoLogan, UT22PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H10KOrganic electric solid-state devicesH10K85/30PVGPATDIS, file of 2026-04-10
G01NInvestigating or analysing materials by determining their chemical or physical propertiesG01N21/35PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-07-31Assignment
Assignment of assignor's interest
RAO, YI signed 2023-07-13UTAH STATE UNIVERSITY NORTH LOGAN, UT64440/376ECORSEXC, file of 2026-09-25
2022-08-01Assignment
Assignment of assignor's interest
CHEN, GUGANG signed 2022-07-29HONDA MOTOR CO., LTD. TOKYO60689/349ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.