Patents
US 12349585 B2: Pb-free perovskite materials for short wave IR devices
- Granted
- 2025-07-01
- Filed
- 2020-11-04 application 17089096
- Type
- Utility · 24 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
The present disclosure is directed to methods of making Pb-free perovskites for short-wave IR (SWIR) devices and to various Pb-free perovskite materials disclosed herein. The perovskites disclosed herein have improved chemical stability and long-term stability, while the production methods disclosed herein have improved safety and lower cost.
Source: PVGPATDIS, file of 2026-04-10 (ipg250701.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HONDA MOTOR CO., LTD. 19,595 patents | Foreign company or organization | Tokyo, JP | PVGPATDIS, file of 2026-04-10 | |
| Utah State University 160 patents | US company or organization | Logan, UT | Utah State University College or university EXACT high confidence: identical full name and state UTAH STATE UNIVERSITY Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Gugang Chen | Powell, OH | 27 | PVGPATDIS, file of 2026-04-10 | |
| Yi Rao | Logan, UT | 22 | PVGPATDIS, file of 2026-04-10 | |
| Xia Li | Logan, UT | 326 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10K | Organic electric solid-state devices | H10K71/441 | PVGPATDIS, file of 2026-04-10 |
| C01G | Compounds containing metals not covered by subclasses c01d or c01f | C01G29/006 | PVGPATDIS, file of 2026-04-10 |
| C01P | Indexing scheme relating to structural and physical aspects of solid inorganic compounds | C01P2002/34 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-11-05 | Assignment Assignment of assignor's interest | LI, XIA signed 2020-10-09 RAO, YI signed 2020-10-09 | UTAH STATE UNIVERSITY LOGAN, UT | 54286/687 | ECORSEXC, file of 2026-09-25 |
| 2020-11-05 | Assignment Assignment of assignor's interest | CHEN, GUGANG signed 2020-10-28 | HONDA MOTOR CO., LTD. TOKYO | 54286/661 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.