Patents
US 12349313 B2: Cooling device having a boiling chamber with submerged condensation and method
- Granted
- 2025-07-01
- Filed
- 2022-11-04 application 17981256
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A device and method including a boiling chamber in which boiling occurs in a pool of liquid and condensation occurs in the same chamber to remove the heat from the condensation process of the bubbles generated during the boiling process mainly through submerged condensation are disclosed.
Source: PVGPATDIS, file of 2026-04-10 (ipg250701.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Rochester Institute of Technology 110 patents | US company or organization | Rochester, NY | Rochester Institute of Technology College or university EXACT high confidence: identical full name and state ROCHESTER INSTITUTE OF TECHNOLOGY Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Satish G. Kandlikar | Rochester, NY | 17 | PVGPATDIS, file of 2026-04-10 | |
| Maharshi Shukla | West Henrietta, NY | 1 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K7/20318 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-12-12 | Assignment Assignment of assignor's interest | KANDLIKAR, SATISH G. signed 2022-11-17 SHUKLA, MAHARSHI signed 2022-11-17 | ROCHESTER INSTITUTE OF TECHNOLOGY ROCHESTER, NY | 62051/716 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.