Patents

US 12318837 B2: Investment casting process for hollow components

Granted
2025-06-03
Filed
2016-02-23 application 15050503
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An investment casting process for a hollow component such as a gas turbine blade utilizing a ceramic core (10) that is cast in a flexible mold (24) using a low pressure, vibration assisted casting process. The flexible mold is cast from a master tool (14) machined from soft metal using a relatively low precision machining process, with relatively higher precision surfaces being defined by a precision formed insert (22) incorporated into the master tool. A plurality of identical flexible molds may be formed from a single master tool in order to permit the production of ceramic cores at a desired rate with a desired degree of part-to-part precision.

Source: PVGPATDIS, file of 2026-04-10 (ipg250603.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
SIEMENS ENERGY, INC. 1,177 patentsUS company or organizationOrlando, FLPVGPATDIS, file of 2026-04-10
RAYTHEON TECHNOLOGIES CORPORATION 2,504 patentsUS company or organizationWaltham, MAPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Gary B. MerrillOrlando, FL51PVGPATDIS, file of 2026-04-10
Andrew J. BurnsLongwood, FL16PVGPATDIS, file of 2026-04-10
Michael P. ApplebyCrozet, VA22PVGPATDIS, file of 2026-04-10
Iain FraserRuckersville, VA23PVGPATDIS, file of 2026-04-10
John R. PaulusAfton, VA24PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B22CFoundry mouldingB22C9/101PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-07-27Name change
Change of name
RAYTHEON TECHNOLOGIES CORPORATION signed 2023-07-14RTX CORPORATION FARMINGTON, CT64402/837PASDL, file of 2026-10-15
2020-12-22Name change
Change of name
UNITED TECHNOLOGIES CORPORATION signed 2020-04-03RAYTHEON TECHNOLOGIES CORPORATION FARMINGTON, CT54825/788ECORSEXC, file of 2026-09-25
2020-09-30Assignment
Assignment of assignor's interest
BURNS, ANDREW J. signed 2011-09-01
MERRILL, GARY B. signed 2011-09-02
SIEMENS ENERGY, INC. ORLANDO, FL53935/411ECORSEXC, file of 2026-09-25
2018-06-28Assignment
Assignment of assignor's interest
MIKRO SYSTEMS, INC. signed 2018-06-18UNITED TECHNOLOGIES CORPORATION FARMINGTON, CT46232/716ECORSEXC, file of 2026-09-25
2018-01-25Assignment
Assignment of assignor's interest
FRASER, IAIN A. signed 2011-09-19
PAULUS, JOHN R. signed 2011-09-19
APPLEBY, MICHAEL signed 2011-09-20
MIKRO SYSTEMS, INC. CHARLOTTESVILLE, VA44725/31ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.