Patents

US 12317019 B2: Adapters for microphones and combinations thereof

Granted
2025-05-27
Filed
2024-03-20 application 18610902
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.

Source: PVGPATDIS, file of 2026-04-10 (ipg250527.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Knowles Electronics, LLC 414 patentsUS company or organizationItasca, ILPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Janice LoPrestiItasca, IL7PVGPATDIS, file of 2026-04-10
Steve KeareyCarpentersville, IL6PVGPATDIS, file of 2026-04-10
Usha MurthyLisle, IL7PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systemsH04R1/04PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2024-03-20Assignment
Assignment of assignor's interest
LOPRESTI, JANICE signed 2020-06-18
MURTHY, USHA signed 2020-06-18
KEAREY, STEVE signed 2020-06-22
KNOWLES ELECTRONICS, LLC ITASCA, IL66846/96ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.