Patents
US 12291445 B2: Dual diaphragm dielectric sensor
- Granted
- 2025-05-06
- Filed
- 2022-03-16 application 17696370
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.
Source: PVGPATDIS, file of 2026-04-10 (ipg250506.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Knowles Electronics, LLC 414 patents | US company or organization | Itasca, IL | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Peter V. Loeppert | Durand, IL | 42 | PVGPATDIS, file of 2026-04-10 | |
| Michael Syskind PEDERSEN | Long Grove, IL | 196 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B3/0086 | PVGPATDIS, file of 2026-04-10 |
| H04R | Loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systems | H04R19/00 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-03-16 | Assignment Assignment of assignor's interest | LOEPPERT, PETER V. signed 2022-03-16 PEDERSEN, MICHAEL signed 2022-03-16 | KNOWLES ELECTRONICS, LLC ITASCA, IL | 59284/23 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.