Patents

US 12247884 B2: Customizable supplies for high temperature exposure monitoring

Granted
2025-03-11
Filed
2021-10-22 application 17508206
Type
Utility · 31 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An excess heat exposure indicator and methods for making the same are disclosed. The excess heat exposure indicator includes a print media substrate comprising an indicator region, a data region, at least one first thermochromic composition is provided on the substrate within the indicator region of the substrate, a second thermochromic composition is provided on the substrate within the data region, the second thermochromic composition configured to change color state from a third color state to a fourth color state when heated above a second temperature threshold, the indicator region is configured to be selectively treated with heat above the first temperature threshold to place a first portion of the indicator region in the second color state, different than the first color state, forming a visible indicia, the visible indicia configured to change appearance when the indicator region is subsequently exposed to a temperature above the first temperature threshold.

Source: PVGPATDIS, file of 2026-04-10 (ipg250311.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
TEMPTIME CORPORATION 59 patentsUS company or organizationLittleton, NJPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Marielle K. SMITHSayreville Junction, NJ14PVGPATDIS, file of 2026-04-10
Mohannad AbdoClifton, NJ51PVGPATDIS, file of 2026-04-10
Eric W. LiberatoPequannock, NJ16PVGPATDIS, file of 2026-04-10
John OlsonNot reported9PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01KMeasuring temperature; measuring quantity of heat; thermally-sensitive elements not otherwise provided forG01K11/12PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-05-29Merger
Merger
TEMPTIME CORPORATION signed 2025-05-22ZEBRA TECHNOLOGIES CORPORATION LINCOLNSHIRE, IL71548/54PASDL, file of 2026-10-15
2022-08-23Assignment
Assignment of assignor's interest
ABDO, MOHANNAD signed 2021-10-21
LIBERATO, ERIC W. signed 2021-10-21
OLSON, JOHN signed 2021-10-21
SMITH, MARIELLE K. signed 2021-10-21
TEMPTIME CORPORATION MORRIS PLAINS, NJ60871/666ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.