Patents
US 12245369 B2: Methods and systems for fabricating 3D multielectrode arrays with 3D printed electrodes
- Granted
- 2025-03-04
- Filed
- 2022-05-06 application 17738817
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.
Source: PVGPATDIS, file of 2026-04-10 (ipg250304.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| University of Oregon 77 patents | US company or organization | Eugene, OR | University of Oregon College or university EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Timothy S. Gardner | Eugene, OR | 14 | PVGPATDIS, file of 2026-04-10 | |
| Kara Zappitelli | Oakland, CA | 1 | PVGPATDIS, file of 2026-04-10 | |
| Morgan P. Brown | Eugene, OR | 3 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/0296 | PVGPATDIS, file of 2026-04-10 |
| A61N | Electrotherapy; magnetotherapy; radiation therapy; ultrasound therapy | A61N1/05 | PVGPATDIS, file of 2026-04-10 |
| B29C | Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing | B29C64/124 | PVGPATDIS, file of 2026-04-10 |
| B33Y | Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering | B33Y10/00 | PVGPATDIS, file of 2026-04-10 |
| B29L | Indexing scheme associated with subclass b29c, relating to particular articles | B29L2031/3406 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-06-02 | Assignment Assignment of assignor's interest | BROWN, MORGAN signed 2022-05-10 GARDNER, TIMOTHY signed 2022-05-17 ZAPPITELLI, KARA signed 2022-05-24 | UNIVERSITY OF OREGON EUGENE, OR | 60079/432 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.