Patents
US 12240748 B2: MEMS die and MEMS-based sensor
- Granted
- 2025-03-04
- Filed
- 2021-03-21 application 17207722
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
Source: PVGPATDIS, file of 2026-04-10 (ipg250304.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Knowles Electronics, LLC 414 patents | US company or organization | Itasca, IL | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Peter V. Loeppert | Durand, IL | 42 | PVGPATDIS, file of 2026-04-10 | |
| Michael Syskind PEDERSEN | Long Grove, IL | 196 | PVGPATDIS, file of 2026-04-10 | |
| Vahid Naderyan | Chicago, IL | 20 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B3/0021 | PVGPATDIS, file of 2026-04-10 |
| H04R | Loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systems | H04R1/04 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-03-21 | Assignment Assignment of assignor's interest | LOEPPERT, PETER V signed 2021-03-16 NADERYAN, VAHID signed 2021-03-16 PEDERSEN, MICHAEL signed 2021-03-16 | KNOWLES ELECTRONICS, LLC ITASCA, IL | 55661/100 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.