Patents

US 12199130 B2: Apparatus for integrated microwave photonics on a sapphire platform, method of forming same, and applications of same

Granted
2025-01-14
Filed
2021-10-25 application 17509635
Type
Utility · 9 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An integrated microwave photonics (IMWP) apparatus is provided using sapphire as a platform. The IMWP apparatus includes: a sapphire substrate having a step-terrace surface; and a III-V stack layer epitaxially grown on the sapphire substrate. The III-V stack layer includes: a first III-V layer disposed on the sapphire substrate; a low temperature (LT) III-V buffer layer disposed on the first III-V layer; multiple second III-V layers disposed and stacked on the LT III-V buffer layer; a third III-V layer disposed on the second III-V layers; a III-V quantum well layer disposed on the third III-V layers; and a fourth III-V layer disposed on the III-V quantum well layer. The second III-V layers are respectively annealed. A growth temperature of the LT III-V layer and a growth temperature of the III-V quantum well layer are lower than a growth temperature of each of the first, second, third and fourth III-V layers.

Source: PVGPATDIS, file of 2026-04-10 (ipg250114.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Board of Trustees of the University of Arkansas 267 patentsUS company or organizationLittle Rock, ARPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Shui-Qing YuFayetteville, AR4PVGPATDIS, file of 2026-04-10
Gregory J. SalamoFayetteville, AR2PVGPATDIS, file of 2026-04-10
Rahul KumarFayetteville, AR7PVGPATDIS, file of 2026-04-10
Samir K. SahaFayetteville, AR1PVGPATDIS, file of 2026-04-10
Yang ZhangFayetteville, AR705PVGPATDIS, file of 2026-04-10
Samir El-GhazalyFayetteville, AR1PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01LSemiconductor devices not covered by class h10H01L21/02631PVGPATDIS, file of 2026-04-10
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F39/189PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P14/22PVGPATDIS, file of 2026-04-10
G02BOptical elements, systems or apparatusG02B6/102PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-10-29Assignment
Assignment of assignor's interest
SALAMO, GREGORY J. signed 2021-10-18
KUMAR, RAHUL signed 2021-10-19
ZHANG, YANG signed 2021-10-20
YU, SHUI-QING signed 2021-10-22
EL-GHAZALY, SAMIR M. signed 2021-10-25
SAHA, SAMIR K. signed 2021-10-28
BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS LITTLE ROCK, AR57975/473ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.