Patents

US 12146369 B2: Boring bit or other bit with hard face wear resistance material

Granted
2024-11-19
Filed
2020-03-31 application 16836175
Type
Utility · 30 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A boring bit such as for horizontal directional drilling is provided which includes a hard faced layer that is preferably made by a laser cladding bead. The laser clad bead may be applied in some regions to a greater extent and in other regions to a lighter extent and with thicker coverage or longer regions of application in different regions of the boring bit. Additionally, circumferential segments of the hard faced layer bead may be applied to impart a spiral path on the outer periphery of the boring bit which may be overlapped upon more general hard faced layer application. Further, the hard faced layer may be applied in substantially complete coverage over carbide insert teeth that are embedded within the steel base of the boring bit body.

Source: PVGPATDIS, file of 2026-04-10 (ipg241119.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Kondex Corporation 25 patentsUS company or organizationLomira, WIPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Keith A. JohnsonWest Bend, WI23PVGPATDIS, file of 2026-04-10
Andrew J. TheisenFond du Lac, WI8PVGPATDIS, file of 2026-04-10
Mark MoreWest Bend, WI4PVGPATDIS, file of 2026-04-10
Casey PlacekCarrer Santiago RusiƱol, WI5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
E21BEarth or rock drilling; obtaining oil, gas, water, soluble or meltable materials or a slurry of minerals from wellsE21B10/54PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-09-03Assignment
Assignment of assignor's interest
JOHNSON, KEITH A. signed 2020-03-27
MORE, MARK signed 2020-03-27
PLACEK, CASEY signed 2020-03-27
THEISEN, ANDREW J. signed 2020-03-27
KONDEX CORPORATION LOMIRA, WI53683/934ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.