Patents

US 12125625 B2: Method of assembling a combined transformer/inductor device

Granted
2024-10-22
Filed
2023-02-15 application 18110039
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A combined transformer/inductor device includes a core having a central core leg and an outer core leg spaced apart from the central core leg, an inner bobbin disposed around the central core leg, an outer bobbin disposed around the inner bobbin and the central core leg and having an upper portion having a first oblong portion disposed around the outer core leg, a lower portion having a second oblong portion disposed around the outer core leg, and a central portion disposed around the inner bobbin and the central core leg, a first winding wound around the inner bobbin, and a second winding wound around the outer bobbin, the second winding having a first portion wound around the first oblong portion, a second portion wound around the central portion, and a third portion wound around the second oblong portion.

Source: PVGPATDIS, file of 2026-04-10 (ipg241022.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Vishay Dale Electronics, LLC 74 patentsUS company or organizationColumbus, NEPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Jason EbnerBarrington, NH3PVGPATDIS, file of 2026-04-10
Matthew FoleyBerwick, ME8PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01FMagnets; inductances; transformers; selection of materials for their magnetic propertiesH01F27/26PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-09-16Security interest Security interest
Security interest
VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC) signed 2025-09-08
VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED) signed 2025-09-08
VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.) signed 2025-09-08
VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.) signed 2025-09-08
VISHAY INTERTECHNOLOGY, INC. signed 2025-09-08
JPMORGAN CHASE BANK, N.A. CHICAGO, IL72272/193PASDL, file of 2026-10-15
2023-02-15Assignment
Assignment of assignor's interest
EBNER, JASON signed 2019-10-23
FOLEY, MATTHEW signed 2019-10-23
VISHAY DALE ELECTRONICS, LLC COLUMBUS, NE62707/756ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.