Patents

US 12084193 B2: Flexible nano coating with significantly enhanced electrical, thermal and semiconductor properties

Granted
2024-09-10
Filed
2022-03-31 application 17657534
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Disclosed herein is a conductive coating composition that includes a functionalized carbon nanomaterial and/or boron nanomaterial and a fluid component. The nanomaterial and fluid component forms hydrogen bond network in the disclosed composition. Because of the formed hydrogen bonds, the disclosed coating exhibits enhanced thermal or electrical conductivity. Also disclosed is a method to improve thermal or electrical conductivity of an existing coating composition.

Source: PVGPATDIS, file of 2026-04-10 (ipg240910.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
SOUTH DAKOTA BOARD OF REGENTS 87 patentsUS company or organizationPierre, SDPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Haiping HongRapid City, SD21PVGPATDIS, file of 2026-04-10
Christian WidenerRapid City, SD11PVGPATDIS, file of 2026-04-10
Gregory Lee ChristensenRapid City, SD6PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C09DCoating compositions, e.g. paints, varnishes or lacquers; filling pastes; chemical paint or ink removers; inks; correcting fluids; woodstains; pastes or solids for colouring or printing; use of materials thereforC09D5/24PVGPATDIS, file of 2026-04-10
B64DEquipment for fitting in or to aircraft; flight suits; parachutes; arrangement or mounting of power plants or propulsion transmissions in aircraftB64D31/04PVGPATDIS, file of 2026-04-10
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredientsC08K3/04PVGPATDIS, file of 2026-04-10
G05DSystems for controlling or regulating non-electric variablesG05D1/0661PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2022-03-31Assignment
Assignment of assignor's interest
HONG, HAIPING signed 2018-08-22
WIDENER, CHRISTIAN signed 2018-08-27
CHRISTENSEN, GREGORY LEE signed 2018-08-22
SOUTH DAKOTA BOARD OF REGENTS PIERRE, SD59464/67PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.