Patents

US 12048253 B2: Electro-formed metal foils

Granted
2024-07-23
Filed
2021-08-06 application 17395507
Type
Utility · 30 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.

Source: PVGPATDIS, file of 2026-04-10 (ipg240723.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
American Superconductor Corporation 53 patentsUS company or organizationAyer, MAPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Cornelis Leo Hans ThiemeWestborough, MA4PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C25DProcesses for the electrolytic or electrophoretic production of coatings; electroforming; apparatus thereforC25D1/003PVGPATDIS, file of 2026-04-10
H10NElectric solid-state devices not otherwise provided forH10N60/0604PVGPATDIS, file of 2026-04-10
C30BSingle-crystal growth ; unidirectional solidification of eutectic material or unidirectional demixing of eutectoid material; refining by zone-melting of material ; production of a homogeneous polycrystalline material with defined structure ; single crystals or homogeneous polycrystalline material with defined structure; after-treatment of single crystals or a homogeneous polycrystalline material with defined structure ; apparatus thereforC30B19/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-08-06Assignment
Assignment of assignor's interest
THIEME, CORNELIS LEO HANS signed 2021-08-04AMERICAN SUPERCONDUCTOR CORPORATION AYER, MA57105/184PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.