Patents
US 11948724 B2: Method for making a multi-thickness electro-magnetic device
- Granted
- 2024-04-02
- Filed
- 2021-06-18 application 17351782
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.
Source: PVGPATDIS, file of 2026-04-10 (ipg240402.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Vishay Dale Electronics, LLC 74 patents | US company or organization | Columbus, NE | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Benjamin M. Hanson | Yankton, SD | 12 | PVGPATDIS, file of 2026-04-10 | |
| Rodney Brune | Columbus, NE | 7 | PVGPATDIS, file of 2026-04-10 | |
| Matt Huber | Yankton, SD | 2 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01F | Magnets; inductances; transformers; selection of materials for their magnetic properties | H01F27/2847 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2025-09-16 | Security interest Security interest Security interest | VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC) signed 2025-09-08 VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY INTERTECHNOLOGY, INC. signed 2025-09-08 | JPMORGAN CHASE BANK, N.A. CHICAGO, IL | 72272/193 | PASDL, file of 2026-10-15 |
| 2022-06-13 | Assignment Assignment of assignor's interest | HANSON, BENJAMIN signed 2021-06-16 BRUNE, RODNEY signed 2021-06-16 HUBER, MATT signed 2021-06-16 | VISHAY DALE ELECTRONICS, LLC COLUMBUS, NE | 60185/607 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.