Patents
US 11876337 B2: Three-level system fiber lasers incorporating an all-solid photonic bandgap fiber
- Granted
- 2024-01-16
- Filed
- 2020-09-21 application 17026760
- Type
- Utility · 17 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
High-power, highly efficient 3-level system fiber lasers are described. The lasers can operate at an average power of about 50W or greater with an efficiency of about 60% or greater with low diffraction limited mode quality. The lasers incorporate an all-solid photonic bandgap fiber that includes a large core (20 micrometers or greater), a high core/clad ratio (greater than 15%), and a waveguide cladding designed to define a transmission band to suppress the 4-level system of the gain medium through determination of the node size of individual nodes of a cladding lattice.
Source: PVGPATDIS, file of 2026-04-10 (ipg240116.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Clemson University 122 patents | US company or organization | Clemson, SC | Clemson University State business registration EXACT high confidence: identical full name and state Clemson University College or university EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Liang Dong | Clemson, SC | 93 | PVGPATDIS, file of 2026-04-10 | |
| Turghun Matniyaz | Clemson, SC | 1 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01S | Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light; devices using stimulated emission of electromagnetic radiation in wave ranges other than optical | H01S3/06741 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-04-07 | Assignment Assignment of assignor's interest | DONG, LIANG signed 2019-11-11 MATNIYAZ, TURGHUN signed 2019-11-11 | CLEMSON UNIVERSITY CLEMSON, SC | 55850/528 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.