Patents

US 11872691 B2: Soft, adaptive, self-cleaning electrostatic gecko-like adhesive and gripper

Granted
2024-01-16
Filed
2020-04-23 application 16856515
Type
Utility · 21 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An adhesive apparatus with an electrostatic adhesive including a microstructured adhesive disposed over an electrode and/or a piezoelectric element. The adhesive can be added to any robotic gripper, such as a gripper finger formed of a flexible material and including a grip surface. The electrode and/or a piezoelectric element can be used for applying an electrostatic field and/or ultrasonic vibration, configured for cleaning the microstructured adhesive, releasing the adhesive, and/or sensing a load on the adhesive apparatus.

Source: PVGPATDIS, file of 2026-04-10 (ipg240116.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Illinois Institute of Technology 82 patentsUS company or organizationChicago, ILIllinois Institute of Technology College or university EXACT high confidence: identical full name and state
ILLINOIS INSTITUTE OF TECHNOLOGY Federal lobbying client EXACT high confidence: identical full name and state
ILLINOIS INSTITUTE OF TECHNOLOGY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Vahid AlizadehyazdiChicago, IL1PVGPATDIS, file of 2026-04-10
Matthew SpenkoChicago, IL5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B25JManipulators; chambers provided with manipulation devicesB25J15/008PVGPATDIS, file of 2026-04-10
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, ; e.g.; for performing mechanical work in generalB06B1/0662PVGPATDIS, file of 2026-04-10
C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesivesC09J7/00PVGPATDIS, file of 2026-04-10
H10NElectric solid-state devices not otherwise provided forH10N30/704PVGPATDIS, file of 2026-04-10
G01NInvestigating or analysing materials by determining their chemical or physical propertiesG01N27/60PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-04-24Assignment
Assignment of assignor's interest
ALIZADEHYAZDI, VAHID signed 2020-04-22
SPENKO, MATTHEW signed 2020-04-22
ILLINOIS INSTITUTE OF TECHNOLOGY CHICAGO, IL52486/169ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.