Patents
US 11859094 B2: Thermal substrate with high-resistance magnification and positive temperature coefficient ink
- Granted
- 2024-01-02
- Filed
- 2022-05-13 application 17743757
- Type
- Utility · 11 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature âTâ and a resistance of the double-resin ink at 25 degrees Celsius.
Source: PVGPATDIS, file of 2026-04-10 (ipg240102.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| LMS Co., Ltd. 85 patents | Foreign company or organization | Marion, OH | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Shuyong Xiao | Ferme-Neuve, CA | 20 | PVGPATDIS, file of 2026-04-10 | |
| Richard C. Abbott | New Boston, NH | 14 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C09D | Coating compositions, e.g. paints, varnishes or lacquers; filling pastes; chemical paint or ink removers; inks; correcting fluids; woodstains; pastes or solids for colouring or printing; use of materials therefor | C09D11/52 | PVGPATDIS, file of 2026-04-10 |
| H05B | Electric heating; electric light sources not otherwise provided for; circuit arrangements for electric light sources, in general | H05B3/10 | PVGPATDIS, file of 2026-04-10 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/0212 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-05-13 | Assignment Assignment of assignor's interest | ABBOTT, RICHARD C. signed 2018-07-20 XIAO, SHUYONG signed 2018-07-31 | LMS CONSULTING GROUP, LLC MARION, OH | 59900/501 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.